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WX3000™ 计量 and Inspection System
WX3000 3D and 2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and productivity. Powered by Multi-Reflection Suppression® (MRS®) Sensor Technology.
Product Video WX3000™ 计量 and Inspection System
概述
计量-Grade Accuracy with MRS® Technology
Sub-micrometer accuracy for features as small as 25 μm. Accurately inspect shiny or mirror-like surfaces. Attain repeatable and reproducible measurements.
Fast, Superior Inspection Performance
Increase throughput with the MRS sensor that is 2-3X faster than alternate technologies, delivering greater than 25 wafers (300mm) per hour for 12" and 8" wafer sizes and 55 wafers per hour (200mm) for 6" and 8" wafer sizes. Attain 3D and 2D measurements in one pass versus multiple separate scans. Conduct 100% 3D and 2D metrology and inspection versus sampling-only methods.
Versatility for Wafer-Level and Advanced Packaging 应用程序
Measure and inspect a wide range of semiconductor applications including gold bumps, solder balls and bumps, 晶圆疙瘩, copper pillars and other wafer-level and advanced packaging applications. Measure and inspect critical packaging features including bump height, 共面, diameter and shape, relative location and variety of other measurements.
Specifications at a Glance
| 3 d功能 | 整片 |
| 3D Repeatability | 0.3 µm @ 3σ (VLSI standard) |
| 3D + 2D Throughput (300mm full wafer) | ≥25 WPH |
| 2D Objectives and Resolution | Fixed resolution – 3μm |
| 2D Measurement Repeatability | 1.6μm @ 3σ |
| 3 d的准确性 | 0.2μm (VLSI standard) |
| Bump Height (Size) Coverage Range | 25-250 μm |
| 3D + 2D Throughput (200mm full wafer) | ≥55 WPH |
| 2D Measurement Accuracy for Bump & RDL | 1/2 (1.5μm) pixel size accuracy |
|
2D Measurement Range |
>20μm |